LAMINATE, METHOD FOR PRODUCING LAMINATE AND MULTILAYER SUBSTRATE

WIPO Patent Application WO/2014/156734

A1

Provided is a laminate wherein the bonding strength between a cured product and a metal layer is increased. A laminate (1) according to the present invention is provided with: a cured product (2) that is obtained by curing an epoxy resin material which contains an epoxy resin, a curing agent and an inorganic filler; and a metal layer (3) that is laminated on the surface of the cured product (2). Parts of the metal layer (3) are embedded in the cured product (2) in a plurality of positions, and the maximum depth among all the depths of the plurality of metal layer parts (3a-3d) embedded in the cured product (2) is 0.5 μm or more, while the maximum interval among all the intervals of the plurality of metal layer parts (3a-3d) embedded in the cured product (2) is 0.5 μm or more.

JP3228003	MANUFACTURE OF LAMINATED SHEET
WO/2013/011677	RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

TANAKA TERUHISA (JP)
HAYASHI TATSUSHI (JP)
KUNIKAWA TOMOKI (JP)
KATAGIRI TOMOAKI (JP)
YOKOTA REONA (JP)
TANAKA TOSHIAKI (JP)
TOTTORI DAISUKE (JP)
MORI NOBUHIRO (JP)
SHIRAHASE KAZUTAKA (JP)

PCT/JP2014/056958

October 02, 2014

March 14, 2014

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SEKISUI CHEMICAL CO LTD (JP)

B32B15/08; C08G59/18

JP2012035631A	2012-02-23
JP2010229227A	2010-10-14
JP2004250674A	2004-09-09

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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