Title:
LAMINATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/045449
Kind Code:
A1
Abstract:
The problem addressed by the present invention is to provide: a laminate that has increased adhesiveness between an Sn plating layer and a coating film laminated on the Sn plating layer, and that can prevent delamination at the interface surface; and a method for producing the laminate. The method for producing a laminate resulting from electrically forming a deposit layer on an Sn plating layer laminated to the surface of a substrate is provided with: an Sn plating step for laminating a glossy Sn plating layer comprising Sn or an Sn alloy onto a substrate in a plating solution containing Sn and a brightener; an acid dipping processing step after the Sn plating step for immersing the glossy Sn plating layer on the substrate in a sulfuric acid solution having a concentration of at least 10 mass% or a hydrochloric acid solution having a concentration of at least 3.5 mass% at 50-80°C for 1-30 minutes; and a deposit layer forming step after the acid dipping processing step for electrically forming a deposit layer on the Sn plating layer.
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Inventors:
ANDO HIROAKI (JP)
IDO TAKAYASU (JP)
YOSHIDA JUNJI (JP)
WATARAI HIROSHI (JP)
MORIMOTO KENJIRO (JP)
IDO TAKAYASU (JP)
YOSHIDA JUNJI (JP)
WATARAI HIROSHI (JP)
MORIMOTO KENJIRO (JP)
Application Number:
PCT/JP2014/058768
Publication Date:
April 02, 2015
Filing Date:
March 27, 2014
Export Citation:
Assignee:
TOYODA GOSEI KK (JP)
International Classes:
C23C28/00; B32B15/04; C23C18/16; C25D5/34; C25D13/20
Domestic Patent References:
| WO2010119489A1 | 2010-10-21 | |||
| WO2012147506A1 | 2012-11-01 |
Foreign References:
| JP2012134435A | 2012-07-12 | |||
| JPH0420022U | 1992-02-19 | |||
| JP2012107263A | 2012-06-07 |
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Makoto Onda (JP)
Makoto Onda (JP)
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