Title:
LAMINATE, AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2015/133351
Kind Code:
A1
Abstract:
In this laminate, copper powder containing 0.002-0.020 wt% of phosphorus, the copper powder having undergone a reduction process, is accelerated together with a gas heated to a lower temperature than the melting point of the copper powder, and is deposited by being sprayed in a still-solid state onto the surface of a substrate, forming a metal film.
Inventors:
TAKIMOTO MASARU (JP)
YAMAUCHI YUICHIRO (JP)
HIRANO SATOSHI (JP)
AIKAWA NAOYA (JP)
YAMAUCHI YUICHIRO (JP)
HIRANO SATOSHI (JP)
AIKAWA NAOYA (JP)
Application Number:
PCT/JP2015/055485
Publication Date:
September 11, 2015
Filing Date:
February 25, 2015
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
C23C24/08
Domestic Patent References:
| WO2005118913A1 | 2005-12-15 | |||
| WO2010024385A1 | 2010-03-04 |
Foreign References:
| JP2011060654A | 2011-03-24 | |||
| JP2010077520A | 2010-04-08 | |||
| JP2009206443A | 2009-09-10 | |||
| JP2004307881A | 2004-11-04 |
Other References:
See also references of EP 3115481A4
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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