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Patent Searching and Data


Title:
LAMINATE FOR PACKAGE AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/044453
Kind Code:
A1
Abstract:
The present invention relates to a stick-type package (1) that comprises a laminate (20), wherein the laminate (20) includes a PET film (21) having a print layer (22) and having a thickness of 9 to 25 μm, a first PE layer (23) having a thickness of 5 to 45 μm, an Al layer (24) having a thickness of 6 to 15 μm, a second PE layer (25) having a thickness of 5 to 45 μm, and a PE film (26) having a thickness of 20 to 40 μm, the first PE layer (23) and the second PE layer (25) comprising extruded resin. Thus, a package that does not tend to bend easily can be provided.

Inventors:
SHINOHARA TAKAYUKI (JP)
NAKANO HIDEMI (JP)
NISHIKAWA AKITOSHI (JP)
Application Number:
PCT/JP2018/031904
Publication Date:
March 05, 2020
Filing Date:
August 29, 2018
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
MOCHIDA PHARM CO LTD (JP)
VESSEL CO LTD (JP)
International Classes:
B65D65/40
Domestic Patent References:
WO2011152521A12011-12-08
Foreign References:
JP2012232753A2012-11-29
JP2017047950A2017-03-09
JP2008162606A2008-07-17
JP2017193120A2017-10-26
JP2012246016A2012-12-13
JP2005170484A2005-06-30
EP2703155A12014-03-05
US20120000969A12012-01-05
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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