LAMINATE POLISHING PAD

WIPO Patent Application WO/2011/118419

A1

Disclosed is a laminate polishing pad having a polishing layer and a cushion layer not prone to separating. The disclosed laminate polishing pad comprises a polishing layer, which does not having a transfixing region, and a cushion layer, which are laminated with an adhesion member interposed therebetween. On the back surface of the aforementioned polishing layer, at least one non-adhesive region X is provided which is continuous from the center area to the outer peripheral edge of the polishing layer; and/or, in the aforementioned adhesion member, at least one non-adhesive area Y is provided which is continuous from the center area to the outer peripheral edge of the adhesive member.

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KAZUNO,Atsushi (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)

JP2011/055817

September 29, 2011

March 11, 2011

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TOYO TIRE & RUBBER CO.,LTD. (17-18, Edobori 1-chomeNishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 Osaka, 〒5508661, JP)

B24B37/00; H01L21/304

UNIUS PATENT ATTORNEYS OFFICE (SHIN-OSAKA MT Bldg. 1, 13-9 Nishinakajima 5-chome, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)

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