Title:
LAMINATE FOR PRINTED CIRCUIT BOARD AND JUNCTION FOR MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/211042
Kind Code:
A1
Abstract:
The present disclosure provides a laminate for printed circuit boards, obtained by laminating a base material, an adhesive layer, and a metal foil in this order. The base material contains a low-dielectric resin material. The adhesive layer contains a thermosetting resin. The maximum height roughness (Rz) of the surface of the metal foil on the adhesive layer side is 10 μm or less. The maximum height roughness (Rz) of the surface of the base material on the adhesive layer side is 0.1 μm or more.
Inventors:
YOSHIMI SEIICHI (JP)
NAKATSUBO JUNYA (JP)
IMAMURA SHIGEKI (JP)
NAKATSUBO JUNYA (JP)
IMAMURA SHIGEKI (JP)
Application Number:
PCT/JP2022/016605
Publication Date:
October 06, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H05K3/38; B32B15/08; H05K3/46
Domestic Patent References:
| WO2020066145A1 | 2020-04-02 | |||
| WO2019188087A1 | 2019-10-03 |
Foreign References:
| JP2005167172A | 2005-06-23 | |||
| JP2018041961A | 2018-03-15 | |||
| JP2006210524A | 2006-08-10 |
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
Download PDF:
Previous Patent: ORGANIC ELECTROLUMINESCENT ELEMENT
Next Patent: SPECTACLE LENS AND METHOD FOR MANUFACTURING SAME
Next Patent: SPECTACLE LENS AND METHOD FOR MANUFACTURING SAME