Title:
LAMINATE FOR PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2006/062138
Kind Code:
A1
Abstract:
This invention provides a laminate for a printed wiring board having a laminate structure comprising an electrical insulator layer (A) and an electrical conductor layer (B) bonded directly to each other. The electrical insulator layer (A) is formed of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer containing an acid anhydride residue and a polymerizable unsaturated bond. The proportion of each repeating unit based on the repeating units((a) + (b) + (c)) is 50 to 99.89% by mole for (a), 0.1 to 49.99% by mole for (b), and 0.01 to 5% by mole for (c). In the electrical conductor layer (B), the surface roughness of the face in contact with the electrical insulator layer (A) is not more than 10 μm. The laminate for a printed wiring board is excellent in signal response in a high frequency region.
Inventors:
IWASA TSUYOSHI (JP)
FUNAKI ATSUSHI (JP)
HIGUCHI YOSHIAKI (JP)
FUNAKI ATSUSHI (JP)
HIGUCHI YOSHIAKI (JP)
Application Number:
PCT/JP2005/022489
Publication Date:
June 15, 2006
Filing Date:
December 07, 2005
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
IWASA TSUYOSHI (JP)
FUNAKI ATSUSHI (JP)
HIGUCHI YOSHIAKI (JP)
IWASA TSUYOSHI (JP)
FUNAKI ATSUSHI (JP)
HIGUCHI YOSHIAKI (JP)
International Classes:
B32B15/082; B32B15/08; H05K1/03
Domestic Patent References:
| WO2003102277A1 | 2003-12-11 |
Foreign References:
| JP2004277689A | 2004-10-07 | |||
| JP2004195776A | 2004-07-15 |
Other References:
See also references of EP 1820637A4
None
None
Attorney, Agent or Firm:
Senmyo, Kenji (38 Kanda-Higashimatsushitach, Chiyoda-ku Tokyo 42, JP)
Download PDF: