Title:
LAMINATE AND RELEASE AGENT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/045026
Kind Code:
A1
Abstract:
A laminate comprising a semiconductor substrate, a support substrate, a release layer provided so as to be in contact with the semiconductor substrate, and an adhesive layer provided between the support substrate and the release layer, wherein the laminate is characterized in that the release layer is a film obtained from a release agent composition containing a polyorganosiloxane component formed from polydimethylsiloxane, the viscosity at 25°C of the polyorganosiloxane component is 5.50×103 Pa⋅s to 0.75×103 Pa⋅s, and the thickness of the film is 0.01-4.90 μm.
Inventors:
OKUNO TAKAHISA (JP)
USUI TOMOKI (JP)
OGATA HIROTO (JP)
MORIYA SHUNSUKE (JP)
YANAI MASAKI (JP)
SHINJO TETSUYA (JP)
USUI TOMOKI (JP)
OGATA HIROTO (JP)
MORIYA SHUNSUKE (JP)
YANAI MASAKI (JP)
SHINJO TETSUYA (JP)
Application Number:
PCT/JP2021/030673
Publication Date:
March 03, 2022
Filing Date:
August 20, 2021
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
B32B27/00; B32B7/06; B32B7/12; H01L21/02
Domestic Patent References:
| WO2017221772A1 | 2017-12-28 | |||
| WO2018083964A1 | 2018-05-11 | |||
| WO2012118700A1 | 2012-09-07 | |||
| WO2015190438A1 | 2015-12-17 |
Foreign References:
| JP2014146793A | 2014-08-14 | |||
| JP2012069783A | 2012-04-05 | |||
| JP2004064040A | 2004-02-26 | |||
| JP2012106486A | 2012-06-07 | |||
| JP2013179135A | 2013-09-09 | |||
| US20120329249A1 | 2012-12-27 | |||
| JP2014146793A | 2014-08-14 |
Attorney, Agent or Firm:
KURIHARA, Hiroyuki et al. (JP)
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