LAMINATE STRUCTURE - MITSUBISHI RAYON CO

Title:

LAMINATE STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2013/099798

Kind Code:

A1

Abstract:

A laminate structure (1) comprises: an article (10) that has a microrelief structure (16) on a surface; and an adhesive film (20) that is in contact with the microrelief structure (16)-side surface of the article (10). The average interval between projections (14) in the microrelief structure (16) is 400 nm or less. The low-speed peel strength of the adhesive film (20) with respect to an acrylic resin plate as determined by a specific method in accordance with JIS Z0237 (2009) is 0.01 N/25 mm or more but less than 2.5 N/25 mm, and the ratio of the high-speed peel strength to the low-speed peel strength of the adhesive film (20) with respect to an acrylic resin plate, namely high-speed peel strength/low-speed peel strength is less than 2.

Inventors:

NAKAI YUSUKE (JP)
MAKINO SHINJI (JP)

Application Number:

PCT/JP2012/083247

Publication Date:

July 04, 2013

Filing Date:

December 21, 2012

Export Citation:

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Assignee:

MITSUBISHI RAYON CO (JP)

International Classes:

B32B7/06; B32B3/30; G02B1/11; G02F1/1335; G09F9/00

Domestic Patent References:

WO2011118367A1

2011-09-29

Foreign References:

JP2009179781A	2009-08-13
JP2011052117A	2011-03-17
JP2010132755A	2010-06-17
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JP2001033776A	2001-02-09
JP2006077139A	2006-03-23
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JP2011088356A	2011-05-06
JP2005156695A	2005-06-16
JP2010107858A	2010-05-13
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Other References: