LAMINATE SUBSTRATE, CONDUCTIVE SUBSTRATE, METHOD FOR MANUFACTURING LAMINATE SUBSTRATE AND METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE

Title:

LAMINATE SUBSTRATE, CONDUCTIVE SUBSTRATE, METHOD FOR MANUFACTURING LAMINATE SUBSTRATE AND METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2016/208654

Kind Code:

A1

Abstract:

Provided is a laminate substrate that comprises a transparent base material and a laminate formed at least on one surface side of the transparent base material, wherein: the laminate comprises a blackened layer containing oxygen, copper and nickel and a copper layer; and, with respect to copper and nickel contained in the blackened layer, the ratio of nickel is 11-60 mass% inclusive.

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Inventors:

NAGATA JUNICHI (JP)

Application Number:

PCT/JP2016/068608

Publication Date:

December 29, 2016

Filing Date:

June 23, 2016

Export Citation:

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Assignee:

SUMITOMO METAL MINING CO (JP)

International Classes:

B32B15/08; G06F3/041; G06F3/044

Foreign References:

JP2008300393A	2008-12-11
JP2015069440A	2015-04-13
JP2005268688A	2005-09-29
JP2015503182A	2015-01-29
JP2001127485A	2001-05-11

Other References: