Title:
LAMINATE SUBSTRATE, METHOD FOR MANUFACTURING LAMINATE SUBSTRATE, ELECTROCONDUCTIVE SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/065184
Kind Code:
A1
Abstract:
Provided is a laminate substrate that is provided with a transparent base material and a laminate formed on at least one surface of the transparent base material. The laminate includes: a blackened layer containing oxygen, copper, and nickel; and a copper layer. The film thickness of the blackened layer is 15 nm or greater, and the mass ratio O/Ni of the oxygen atoms and nickel atoms contained in the blackened layer satisfies formula (1). Formula (1): 0.1≤O/Ni≤0.8
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Inventors:
WATANABE HIROTO (JP)
Application Number:
PCT/JP2016/080279
Publication Date:
April 20, 2017
Filing Date:
October 12, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B32B15/04; B32B15/20; C23C14/06; C23C14/14; G06F3/041; H01B5/14; H01B13/00
Foreign References:
JP2008300393A | 2008-12-11 | |||
JP2005268688A | 2005-09-29 | |||
JP2015069440A | 2015-04-13 | |||
JP2015103223A | 2015-06-04 | |||
JP2001127485A | 2001-05-11 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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