Title:
LAMINATE FOR TEMPORARY BONDING IN SEMICONDUCTOR DEVICE MANUFACTURE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/157227
Kind Code:
A1
Abstract:
Provided is a laminate for temporary bonding in semiconductor device manufacture which is capable of reliably and easily providing temporary support for a member (such as a semiconductor wafer) being mechanically or chemically processed, wherein, even in high-temperature processing, said temporary support can easily be removed without damaging the member when processing has been completed; also provided is a semiconductor device manufacturing method. This laminate for temporary bonding in semiconductor device manufacture has (A) a release layer and (B) an adhesive layer, and the release layer contains (a1) a 25°C liquid compound and (a2) a binder, wherein the temperature at which said compound decreases in weight by 5 mass% when measured under a nitrogen stream under conditions in which the temperature rises at a constant rate of 20°C/min is 250°C or greater, and the temperature at which said binder decreases in weight by 5 mass% when measured under a nitrogen stream under conditions in which the temperature rises at a constant rate of 20°C/min is 250°C or greater.
Inventors:
KOYAMA ICHIRO (JP)
IWAI YU (JP)
FUJIMAKI KAZUHIRO (JP)
IWAI YU (JP)
FUJIMAKI KAZUHIRO (JP)
Application Number:
PCT/JP2014/058325
Publication Date:
October 02, 2014
Filing Date:
March 25, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J7/00; C09J7/02; C09J11/06; C09J201/00; H01L21/02; H01L21/304
Foreign References:
| JP2012089605A | 2012-05-10 | |||
| JP2011006595A | 2011-01-13 | |||
| JP2011233679A | 2011-11-17 | |||
| JP2008034623A | 2008-02-14 | |||
| JP2004119780A | 2004-04-15 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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