CROSS-REFERENCE TO RELATED APPLICATIONS

[001] This application claims the benefit of priority under 35 U.S.C. § 1 19 of U.S. Provisional Application No. 63/283,040, filed November 24, 2021, the content of which is incorporated herein by reference in its entirety.

FIELD OF THE INVENTION

[002] Broadly, the present disclosure is directed towards embodiments having integrated electronics or optoelectronic functionality incorporated directly onto or into a glass laminate. More specifically, the present disclosure is directed towards various embodiments of laminates having sensors and or passive devices configured within a discrete layer of the glass laminate stack and/or configured between the discrete layers of the glass laminate stack, optionally with spacers utilized to promote a uniform cross sectional thickness between the layers.

BACKGROUND

[003] Laminates having glass are used for architectural and automotive applications. The glass surface provides an aesthetic appearance, is easy to clean and maintain, may be made to be scratch and bacteria resistant. However, the surfaces of glass laminates for architectural and automotive applications currently are passive, not having electronic functionality. It would be desirable to convert an otherwise passive wall surface for example such that a user may actuate sensors and/or engage electronic devices on the surface to operate various appliances and devices. Incorporating various other sensors into architectural products is challenging. SUMMARY

[004] Broadly, the present disclosure is directed towards embodiments having electronic or optoelectronic functionality incorporated into a laminate having glass. More specifically, the present disclosure is directed towards various embodiments of laminates which have the capability' to control operation of electronic devices by actuation of a sensor or operation of an electronic device embedded beneath the surface of the laminate. This is accomplished by incorporating sensors and/or electronic devices into the construction of the laminate and directing the signal from the sensor(s) to at least one device for control of at least one device which may be of electronic, electrical or optoelectronic nature. In addition, the sensors and the accessories may be incorporated in a manner that does not affect the appearance of at least one surface of the laminate so that the laminate may retain aesthetic appeal tor architectural, automotive, and other uses. Also, the construction of the laminate is configured such that it is easy for the users to control operation of various devices. These sensors and/or devices include: temperature sensors, touch sensors, haptic sensors, camera/imaging device, and/or communication device/antenna. In the sensor or passive electronic device’s embedded state in the glass laminate, functionality and sensitivity' is retained in the embedded state.

[005] As set forth herein, various embodiments of glass laminates are provided, where the glass laminate includes at least one sensor and/or an electronic device incorporated into the stack, i.e. either between various layers in the stack or as a component of a stack, where the glass laminate with such a configuration has tailored, integrated functionality as an architectural product and/or an automotive product. As embodied herein, the sensors are active devices, where they are actuated through one or more layers of the glass laminate, where the sensor directs a signal to a control system (retained within or external to the glass laminate), such that a response is generated. As the response is generated, an electrical component is actuated, in that it is turned on, turned off, or adjusted (i.e. increased or decreased). In addition/as an alternative to the sensors, passive devices like antenna/communi cation devices are configured within the glass laminate and further configured to interact with external, electronic devices (e.g. cell phones). In instances of either sensors and/or passive devices being incorporated into the glass laminate, there’s no perturbation to the front face of the laminate, so the devices are configured to be aesthetically pleasing and/or unobstructive to interior construction.

[006] As set out herein, depending on the type of sensor or passive device, the glass laminate is tailored to provide advantages including optimum performance of the sensor and/or passive device for its intended application/ response generated. Similarly, the integration of the sensor into the glass laminate stack is configured in such a way so as to promote signal function and preserve the sensor signal as a function of characteristic in the laminated condition nearly the same as the sensor by itself before lamination.

[007] As set forth herein, the design includes considerations for routing of device interfaces (e.g. wiring) to a power source (e.g. batery, power source of a building, etc).

[008] Additional features and advantages will be set forth in the detailed description which follows and will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as described herein, including the detailed description which follows, the claims, as well as the appended drawings.

[009] It is to be understood that both the foregoing general description and the following detailed description are merely exemplary and are intended to provide an overview or framework to understanding the nature and character of the disclosure as it is claimed.

[0010] The accompanying drawings are included to provide a further understanding of principles of the disclosure, and are incorporated in, and constitute a part of, this specification. The drawings illustrate one or more embodiment(s) and, together with the description, serve to explain, by way of example, principles and operation of the disclosure. It is to be understood that various features of the disclosure disclosed in this specification and in the drawings can be used in any and all combinations. By way of non-limiting examples, the various features of the disclosure may be combined with one another according to the following aspects.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] These and other features, aspects and advantages of the present disclosure are better understood when the following detailed description of the disclosure is read with reference to the accompanying drawings, in which:

[0012] Figure 1 depicts schematic embodiments of a cut-away side view of glass laminates configured with sensor(s) and/or passive electronic device(s) in accordance with various embodiments of the present disclosure.

[0013] Figure 2 depicts schematic embodiments of a cut-away side view of glass laminates configured with touch sensor(s), in accordance with various embodiments of the present disclosure

[0014] Figure 3 depicts schematic embodiments of a cut-away side view of glass laminate configured with haptic sensor(s), in accordance with various embodiments of the present disclosure.

[0015] Figure 4 depicts schematic embodiments of a cut-away side view of glass laminate configured with temperature sensor(s), in accordance with various embodiments of the present disclosure.

[0016] Figure 5 depicts schematic embodiments of a cut-away side view of glass laminate configured with a passive device configured as an imaging device/camera, in accordance with various embodiments of the present disclosure.

[0017] Figure 6 depicts schematic embodiments of a cut-away side view of glass laminate configured with a passive device configured as an antenna/communication member, in accordance with various embodiments of the present disclosure. [0018] Figure 7 depicts a method of using an embodiment of a laminate having an onboard

(e.g. configured onto or into) sensor and/or device, in accordance with the present disclosure.

DETAILED DESCRIPTION OF THE DRAWINGS

[0019] In the following detailed description, for purposes of explanation and not limitation, example embodiments disclosing specific details are set forth to provide a thorough understanding of various principles of the present disclosure. However, it will be apparent to one having ordinary skill in the art, having had the benefit of the present disclosure, that the present disclosure may be practiced in other embodiments that depart from the specific details disclosed herein. Moreover, descriptions of well-known devices, methods and materials may be omitted so as not to obscure the description of various principles of the present disclosure. Finally, wherever applicable, like reference numerals refer to like elements.

[0020] Figure 1 depicts embodiments of a glass laminate 10 configuration in two views - generic top stack 20 vs. bottom stack 30 configuration on the left and on the right side: a more detailed schematic view' of the various layers (including example materials) in each of the top stack 20 and bottom stacks 30 of the glass laminate 10. Also, with respect to the more detailed glass laminate 10 schematic view', there are four arrow's indicating four non-limiting examples of positions within the glass laminate 10 where a sensor 40 may be configured and/or located. The 4 arrows are denoted as A; B; C; and D.

[0021] Referring to Figure 1, the top stack 20 of the glass laminate includes: a glass substrate (e.g. thin glass) 22 as the upper surface, folio wed by an adhesive layer 24 which adheres the thin glass 22 onto a substrate 26 (e.g. depicted as substrate 1 , a glass backer substrate). The bottom stack 30 includes a substrate 34 adhered onto another substrate 38 (e.g. backer substrate, depicted as substrate 3) via an adhesive layer 36 (depicted as adhesive 3). [0022] An adhesive 32 is configured between the top stack 20 and bottom stack 30 to adhere the two together, is adhered to the top stack 20 via an adhesive 32 (e.g. depicted as adhesive 2). While the adhesive 32 is depicted as in tire bottom stack 30, it is also noted that the adhesive can be optionally configured in the top stack 20.

[0023] In sensor 40 location A, the sensor(s) 40 are positioned between the top stack 20 (beneath lower most layer of top stack) and tire bottom stack 30 (above the upper most layer of top stack). In sensor 40 location B, the sensor(s) 40 are positioned within the substrate body 34 of the bottom stack 30 (e.g. substrate 2), via sensor hole(s)/laminate layer hole(s) 54(or cutouts) in the substrate body 34. In sensor 40 location C, the sensor(s) 40 are positioned between layers of the bottom stack 30, specifically, between substrate 2 34 (e.g. the substrate body), and substrate 3 38 (e.g. the substrate body backer). In sensor 40 location D, the sensor(s) 40 are positioned beneath the botom stack 30.

[0024] A typical glass laminate as shown m the Figures may be thought of as a laminate of two laminates: a top stack and a bottom stack as shown in the Figures. The top stack is glass layer (e.g. a thin piece of glass such as 0.2 mm thick Willow® glass) which is laminated (e.g. via an adhesive like optically clear adhesive, OCA) on backer substrate (e.g, solid backing such as 0.45 mm steel or 0.40 mm thick high pressure laminate) to give the top stack structural rigidity and strength. The top stack is self-contained and can be handled by itself.

[002.5] This can have a thickness of 0.05mm to 1mm, 0.1mm to 0,5mm, 0. 1mm to 0.3mm. Tlie top stack can have a dimension on an edge >0.1m, >0.5m, >lm, >2m, >3m, >4m. The glass layer can be a single material or a multi-layer stack of glass, glass ceramic, ceramic, or polymer layers. The glass layer can be an ion exchanged layer or non -ion exchanged , The glass laminate can be substantially flat or have a radius of <10m, <5m, <3m, <2m, <lm, <0.5m. Multiple glass laminates with integrated same or differing functionality can be adjacent or tiled to form a wall, smart wall, or large area functional surface. [0026] The botom stack is made of a laminate which typically does not contain glass, and it may be constructed in many different ways to suit the needs of various applications. For example, the bottom stack may be made of building structural materials for architectural use or it may be made of automotive grade material for automotive use. For architectural use, a typical bottom stack is shown in the Figures comprising a substrate body (e.g. medium density fiberboard or MDF) and body-backing substrate (e.g. steel). Other non-limiting examples of substrate body components include high pressure laminate (HPL) or triceil may aiso be used in the construction of the bottom stack. Like the top stack, the bottom stack is also self- contained and can be handled by itself. The top stack may be fixed to the botom stack using pressure sensitive adhesive (PSA), transfer tape or adhesive which is melted and solidified in place.

[0027] Referring to Figure 1, schematic embodiments of a cut-away side view of glass laminates configured with sensor(s) and/or passive electronic device(s) in accordance with various embodiments of the present disclosure. The top stack and bottom stack of the glass laminate are shown individually at the left view, and their respective components (in nonlimiting example form) are provided in the glass laminate layers depicted on the right. To the right of the glass laminate layers, there are five (5) arrow s depicting the relative locations of the sensors and/or passive devices, as embodied herein. The positions are labeled A, B, C, D, and E for clarity'.

[0028] Figure 2 depicts schematic embodiments of a cut-away side view of glass laminates configured with touch sensor(s), in accordance with various embodiments of the present disclosure. Referring to Figure 2, the touch sensor is configured in the top stack, in close proximity to the thin glass layer. [0029] In some embodiments, the touch sensor is positioned between the thin glass layer and the first adhesive layer. In some embodiments, one or more spacers are configured within the adhesive layer, positioned adjacent to the touch sensor(s).

[0030] In some embodiments, the touch sensor is positioned within the first adhesive layer, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between die thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the touch sensor(s).

[0031] As shown in Figure 2, E refers to a position on top of the adhesive or within the adhesive layer, in accordance with various embodiments of the present disclosure.

[0032] Figure 3 depicts schematic embodiments of a cut-away side view of glass laminate configured with haptic sensor(s), in accordance with various embodiments of the present disclosure.

[0033] Referring to Figure 3, there are two locations where the haptic sensor is configured within die glass laminate, including positions A and E (denoted with corresponding arrows). As a non-limiting example, as haptic sensors are configured to vibrate with electrical inputs, the sensors can be utilized to locate a light switch, or other building controls that may be otherwise discretely covered by the aesthetically pleasing glass laminate. It’s noted, with location A, the first substrate in the top stack is a transparent substrate (e.g. an acrylic material). [0034] In some embodiments, the haptic sensor is positioned between the thin glass layer and tire first adhesive layer. In some embodiments, one or more spacers are configured within the adhesive layer, positioned adjacent to the haptic sensor(s).

[0035] In some embodiments, the haptic sensor is positioned within the first adhesive layer, such drat the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the haptic sensor(s). [0036] In some embodiments, the haptic sensor is positioned between the first substrate and the second adhesive layer. In some embodiments, one or more spacers are configured adjacent to the haptic sensor, between the first substrate and the second adhesive layer.

[0037] In some embodiments, the haptic sensor is positioned within the first substate or the second adhesive, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the haptic sensor(s). Alternatively, in some embodiments, the first substrate has a cut out or discontinuous portion configured to enable the haptic sensor to be retained there between.

[0038] Figure 4 depicts schematic embodiments of a cut-away side view of glass laminate configured with temperature sensor(s), in accordance with various embodiments of the present disclosure.

[0039] Referring to Figure 4, there are five general locations where the temperature sensor is configured within the glass laminate, including positions A, B, C, D, and E (denoted with corresponding arrow's). As a non-limiting example, as temperature sensors are configured to measure and communicate room temperature and or localized raises in temperature (e.g. occupants), and communicate with the corresponding HVAC or heating and cooling system in order to promote physical comfort of occupants. It’s noted, with location A, the first substrate in the top stack is a transparent substrate (e.g. an acrylic material).

[0040] In some embodiments, the temperature sensor is positioned between the thin glass layer and the first adhesive layer. In some embodiments, one or more spacers are configured within the adhesive layer, positioned adjacent to the temperature sensor(s).

[0041] In some embodiments, the temperature sensor is positioned within the first adhesive layer, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the temperature sensor(s).

[0042] In some embodiments, the temperature sensor is positioned between the first substrate and the second adhesive layer. In some embodiments, one or more spacers are configured adjacent to the temperature sensor, between the first substrate and the second adhesive layer.

[0043] In some embodiments, the temperature sensor is positioned within the first substate or the second adhesive, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the temperature sensor(s). Alternatively, in some embodiments, the first substrate has a cut out or discontinuous portion configured to enable the temperature sensor to be retained there between. [0044] In some embodiments, the temperature sensor is positioned between the second adhesive layer and the second substrate. In some embodiments, one or more spacers are configured adjacent to the temperature sensor, between the second adhesive layer and the second substrate.

[0045] In some embodiments, the temperature sensor is positioned within the second substate, such that the second substrate layer has a relatively uniform cross-sectional thickness. In some embodiments, the second substrate has a cut out or discontinuous portion configured to enable the temperature sensor to be retained there between.

[0046] In some embodiments, the temperature sensor is positioned between the second substrate and the third adhesive layer. In some embodiments, one or more spacers are configured adjacent to the temperature sensor, between the second substrate and the third adhesive layer. [0047] In some embodiments, the temperature sensor is positioned within the second substrate or the third adhesive, such that the substrate or adhesive layer has a relatively uniform cross-sectional thickness. In some embodiments, one or more spacers are configured within the third adhesive layer, adjacent to the temperature sensor(s). Alternatively, in some embodiments, the second substrate has a cut out or discontinuous portion configured to enable the temperature sensor to be retained there between.

[0048] In some embodiments, the temperature sensor is positioned behind the third substrate or within the third substrate. In some embodiments, one or more spacers are configured adjacent to the temperature sensor, between the third substrate and the mounting surface (i.e. where the glass laminate is mounted thereto).

[0049] In some embodiments, the temperature sensor is positioned within the third substrate, such that the third substrate or adhesive layer has a relatively uniform cross-sectional thickness. Alternatively, in some embodiments, the third substrate has a cut out or discontinuous portion configured to enable the temperature sensor to be retained there between. [0050] Figure 5 depicts schematic embodiments of a. cut-away side view of glass laminate configured with a passive device configured as an imaging device/camera, in accordance with various embodiments of the present disclosure.

[0051] Referring to Figure 5, there are five general locations where the imaging device is configured within the glass laminate, including positions A, B, C, D, and E (denoted with corresponding arrows). As a non-limiting example, the imaging device is configured to obtain images from a position external to the glass laminate (i.e. in the room) and communicate to monitors or other equipment. It’s noted, with locations A, B, C, and D, the substrates and/or adhesive are configured to provide sufficient optical properties to the imaging device. In some embodiments, the locations corresponding to a non-transparent substate have a cut-out or discontinuous region, where the imaging device is retained therein, such that the remainder of the cross-sectional thickness from the imaging device’s position to the thin glass layer is configured with sufficient optical properties for the imaging device to function accordingly.

[0052] In some embodiments, the imaging device is positioned between the thin glass layer and the first adhesive layer. In some embodiments, one or more spacers are configured within the adhesive layer, positioned adjacent to the imaging device.

[0053] In some embodiments, the imaging device is positioned within the first adhesive layer, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the imaging device.

[0054] In some embodiments, the imaging device is positioned between the first substrate and the second adhesive layer. In some embodiments, one or more spacers are configured adjacent to the imaging device, between the first substrate and the second adhesive layer.

[0055] In some embodiments, the imaging device is positioned within the first substate or the second adhesive, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the imaging device. Alternatively, in some embodiments, the first substrate has a cut out or discontinuous portion configured to enable the imaging device to be retained there between.

[0056] In some embodiments, the imaging device is positioned between the second adhesive layer and the second substrate. In some embodiments, one or more spacers are configured adjacent to the imaging device, between the second adhesive layer and the second substrate.

[0057] In some embodiments, the imaging device is positioned within the second substate, such that the second substrate layer has a relati vely uniform cross-sectional thickness. In some embodiments, the second substrate has a cut out or discontinuous portion configured to enable the imaging device to be retained there between. [0058] In some embodiments, the imaging device i s posi ti oned between the second substrate and the third adhesive layer. In some embodiments, one or more spacers are configured adjacent to the imaging device, between the second substrate and the third adhesive layer.

[0059] In some embodiments, the imaging device is positioned within the second substrate or the third adhesive, such that the substrate or adhesive layer has a relatively uniform cross- sectional thickness. In some embodiments, one or more spacers are configured within the third adhesive layer, adjacent to the imaging device. Alternatively, in some embodiments, the second substrate has a cut out or discontinuous portion configured to enable the imaging device to be retained there between.

[0060] In some embodiments, the imaging device is positioned behind the third substrate or within the third substrate. In some embodiments, one or more spacers are configured adjacent to the imaging device, between the third substrate and the mounting surface (i.e, where the glass laminate is mounted thereto).

[0061] In some embodiments, the imaging device is positioned within the third substrate, such that the third substrate or adhesive layer has a relatively uniform cross-sectional thickness. Alternatively, in some embodiments, the third substrate has a cut out or discontinuous portion configured to enable the imaging device to be retained there between.

[0062] Figure 6 depicts schematic embodiments of a cut-away side view of glass laminate configured with a passive device configured as an antenna/communication member, in accordance with various embodiments of the present disclosure.

[0063] Referring to Figure 6, there are five general locations where the antenna is configured within the glass laminate, including positions A, B, C, D, and E (denoted with corresponding arrows). As a non-limiting example, the antenna is configured to obtain images from a position external to the glass laminate (i.e. in the room) and communicate to monitors or other equipment. It’s noted, when the passive device is configured as an antenna, none of the substrates include metal .

[0064] In some embodiments, the antenna is positioned between the thin glass layer and the first adhesive layer. In some embodiments, one or more spacers are configured within the adhesive layer, positioned adjacent to the antenna.

[0065] In some embodiments, the antenna is positioned within the first adhesive layer, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the antenna.

[0066] In some embodiments, the antenna is positioned between the first substrate and the second adhesive layer. In some embodiments, one or more spacers are configured adjacent to the antenna, between the first substrate and the second adhesive layer.

[0067] In some embodiments, the antenna is positioned within the first substate or the second adhesive, such that the adhesive layer has a relatively uniform cross-sectional thickness when measured between the thin glass layer and first substrate. In some embodiments, one or more spacers are configured within the adhesive layer, adjacent to the antenna. Alternatively, in some embodiments, the first substrate has a cut out or discontinuous portion configured to enable the antenna to be retained there between.

[0068] In some embodiments, the antenna is positioned between the second adhesive layer and the second substrate. In some embodiments, one or more spacers are configured adjacent to the antenna, between the second adhesive layer and the second substrate.

[0069] In some embodiments, the antenna is positioned within the second substate, such that the second substrate layer has a relatively uniform cross-sectional thickness. In some embodiments, the second substrate has a cut out or discontinuous portion configured to enable the antenna to be retained there between. [0070] In some embodiments, the antenna is positioned between the second substrate and the third adhesive layer, hi some embodiments, osie or more spacers are configured adjacent to the antenna, between the second substrate and the third adhesive layer.

[0071] In some embodiments, the antenna is positioned within the second substrate or the third adhesive, such that the substrate or adhesive layer has a relatively uniform cross-sectional thickness. In some embodiments, one or more spacers are configured within the third adhesive layer, adjacent to the antenna. Alternatively, in some embodiments, the second substrate has a cut out or discontinuous portion configured to enable the antenna to be retained there between. [0072] In some embodiments, the antenna is positioned behind the third substrate or within the third substrate. In some embodiments, one or more spacers are configured adjacent to the antenna, between the third substrate and the mounting surface (i.e. where the glass laminate is mounted thereto).

[0073] In some embodiments, the antenna is positioned within the third substrate, such that the third substrate or adhesive layer has a relatively uniform cross-sectional thickness. Alternatively, in some embodiments, the third substrate has a cut out or discontinuous portion configured to enable the antenna to be retained there between.

[0074] Figure 7 depicts a method of using an embodiment of a laminate having an onboard (e.g. configured onto or into) sensor and/or device, in accordance with the present disclosure. [0075] Many variations and modifications may be made to the above-described embodiments of the disclosure without departing substantially from the spirit and various principles of the disclosure. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.