Title:
LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/032521
Kind Code:
A1
Abstract:
Provided is a laminate that has excellent long-term heat resistance even when an inorganic substrate having a high surface roughness is used. This laminate is characterized by having an inorganic substrate, a silane coupling agent layer, and a heat-resistant polymer film in this order, and satisfying the following (A)-(C). (A) The peel strength F0 of the laminate, as measured by a 90º peeling method, is 1.0-20 N/cm. (B) In the surface of the inorganic substrate after peeling the heat-resistant polymer film from the laminate at 90º, the area of a peeled portion on the boundary surface between the inorganic substrate and the silane coupling agent layer is at most 20% of the entire peeled surface. (C) The peel strength F1 of the laminate, as measured by the 90º peeling method after heating in a nitrogen atmosphere at 350ºC for 500 hours, is greater than F0.
Inventors:
TOKUDA KAYA (JP)
OKUYAMA TETSUO (JP)
MATSUO KEISUKE (JP)
OKUYAMA TETSUO (JP)
MATSUO KEISUKE (JP)
Application Number:
PCT/JP2022/028489
Publication Date:
March 09, 2023
Filing Date:
July 22, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B15/088; B32B9/00; B32B27/34; C08J5/12; C08J5/18
Domestic Patent References:
| WO2018221374A1 | 2018-12-06 | |||
| WO2016031746A1 | 2016-03-03 |
Foreign References:
| JP2017126728A | 2017-07-20 | |||
| JP2018126922A | 2018-08-16 | |||
| JP2015178237A | 2015-10-08 | |||
| JP2020059169A | 2020-04-16 | |||
| JP2020059226A | 2020-04-16 | |||
| JP2006231134A | 2006-09-07 | |||
| JP2007155913A | 2007-06-21 | |||
| JP2011063760A | 2011-03-31 |
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