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Patent Searching and Data


Title:
LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/243693
Kind Code:
A1
Abstract:
[Problem] To provide a laminate of a polyimide film and a protective film, the laminate having favorable strength, handling properties, die-cutting processability, and winding-up performance. [Solution] Provided is a laminate comprising a polyimide film and a protective film which is layered on at least one surface of the polyimide film. The yellowness index of the polyimide film is 10 or less. The protective film includes a polyethylene terephthalate structure. The product of the tensile modulus of elasticity E1 (GPa) and the film thickness T1 (μm) of the laminate is 200-340.

Inventors:
NAKAMURA MAKOTO (JP)
Application Number:
PCT/JP2023/022319
Publication Date:
December 21, 2023
Filing Date:
June 15, 2023
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/34; B32B7/022; B32B27/36
Domestic Patent References:
WO2022185607A12022-09-09
WO2013191052A12013-12-27
WO2020261775A12020-12-30
WO2021124865A12021-06-24
WO2021045557A12021-03-11
WO2021066516A12021-04-08
Foreign References:
JP2021024283A2021-02-22
JP2007320058A2007-12-13
JP2020100026A2020-07-02
JPH115954A1999-01-12
JP2020093534A2020-06-18
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