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Title:
LAMINATED BOARD AND METHOD FOR PROCESSING LAMINATED BOARD
Document Type and Number:
WIPO Patent Application WO/2017/141497
Kind Code:
A1
Abstract:
This laminated board 1 comprises: a difficult-to-machine layer 11 formed of a composite material including a fiber and a resin material; and a pair of hard layers 12 layered on both front and back surfaces of the difficult-to-machine layer 11 and formed of a hard material that is harder than the composite material of the difficult-to-machine layer 11. Each hard layer 12 is formed of a composite material including carbon fiber and a resin. The difficult-to-machine layer 11 and the pair of hard layers 12 are molded integrally. The resin included in the difficult-to-machine layer 11 and the resin included in the hard layer 12 are isogeneic resins, and an epoxy resin is used.

Inventors:
KAMO, Sota (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
TAKAGI, Kiyoka (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
ISHIDA, Jun (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
ABE, Toshio (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
KONO, Akira (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
SHIMIZU, Takayuki (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
AZUSAWA, Naoto (16-5, Konan 2-chome, Minato-k, Tokyo 15, 〒1088215, JP)
Application Number:
JP2016/081693
Publication Date:
August 24, 2017
Filing Date:
October 26, 2016
Export Citation:
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Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (16-5, Konan 2-chome Minato-k, Tokyo 15, 〒1088215, JP)
International Classes:
B32B5/00; B32B5/28; B23B35/00
Domestic Patent References:
WO2014157570A12014-10-02
Foreign References:
US20140087617A12014-03-27
JP2014168821A2014-09-18
Other References:
See also references of EP 3418047A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (Toranomon Mitsui Building, 8-1 Kasumigaseki 3-chome, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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