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Patent Searching and Data


Title:
LAMINATED BOARD AND TERMINAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/216029
Kind Code:
A1
Abstract:
The present application provides a laminated board (10) and a terminal device (20). The laminated board (10) comprises a main board (11), a ring-shaped connecting board (12) and an auxiliary board (13); a first connecting board bonding pad (121) and a second connecting board bonding pad (122) are provided on one side of the connecting board (12), and a third connecting board bonding pad (123) and a fourth connecting board bonding pad (124) are provided on the other side of the connecting board (12); the main board (11) is provided with a first main board bonding pad (111) and a second main board bonding pad (112); the auxiliary board (13) is provided with a first auxiliary board bonding pad (131) and a second auxiliary board bonding pad (132). By additionally providing bonding pads on upper and lower sides of the connecting board (12), and additionally providing bonding pads on the main board (11) and the auxiliary board (13) correspondingly, connection strength between the main board (11) and the connecting board (12) and connection strength between the connecting board (12) and the auxiliary board (13) can be effectively increased.

Inventors:
CHEN YAN (CN)
Application Number:
PCT/CN2020/082773
Publication Date:
October 29, 2020
Filing Date:
April 01, 2020
Export Citation:
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Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K1/11; H05K1/14
Foreign References:
CN110035601A2019-07-19
CN108615772A2018-10-02
CN104637909A2015-05-20
CN101730382A2010-06-09
CN103500729A2014-01-08
CN1288255A2001-03-21
CN107993987A2018-05-04
CN1652663A2005-08-10
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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