LAMINATED BODY COMPRISING METAL WIRE LAYER, AND MANUFACTURING METHOD THEREFOR

Title:

LAMINATED BODY COMPRISING METAL WIRE LAYER, AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2016/200122

Kind Code:

A1

Abstract:

The present invention relates to a method for manufacturing a flexible substrate in which a metal wire is embedded, and provides a laminated body comprising: a carrier substrate; a debonding layer disposed on at least one surface of the carrier substrate and comprising a polyimide-based resin; a metal wire layer in contact with the debonding layer; and a flexible substrate layer in contact with the metal wire layer. The adhesive force between the metal wire layer and the flexible substrate layer is greater than the adhesive force between the metal wire layer and the debonding layer. Thus, even if a laser irradiation process, a light irradiation process, or the like is not performed, it is possible to easily separate the flexible substrate having the metal wire layer from the carrier substrate. In addition, since a metal wire can be embedded in the flexible substrate layer, the surface resistance of an electrode can be reduced, and even if the shape of a substrate is deformed, it is possible to prevent the metal wire from being damaged or cut as the metal wire is embedded in the substrate.

Inventors:

JEONG HYE WON (KR)
SHIN BO RA (KR)
KIM KYUNGJUN (KR)
MYUNG JI EUN (KR)
SON YONG GOO (KR)

Application Number:

PCT/KR2016/006019

Publication Date:

December 15, 2016

Filing Date:

June 08, 2016

Export Citation:

Click for automatic bibliography generation Help

Assignee:

LG CHEMICAL LTD (KR)

International Classes:

H05K1/03; B32B15/088; C08G73/10; H05K1/02; H05K3/38

Foreign References:

KR20140122207A	2014-10-17
KR101191865B1	2012-10-16
KR100731856B1	2007-06-25
KR20130046150A	2013-05-07
KR20100027526A	2010-03-11

Other References: