Title:
LAMINATED BODY, MANUFACTURING METHOD THEREFOR, AND LAMINATED PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/142051
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a laminated body, a manufacturing method therefor, and a laminated packaging material, with which it is possible to simplify the structure of an extraction electrode part, increase freedom of product shape, and increase productivity. This laminated body has a substrate and a conductive layer, has a transmittance of 60% or greater, and has a haze value of less than 10%. The substrate has a through-hole, which is filled by a section of the conductive layer.
Inventors:
HIRAKATA JUNICHI (JP)
Application Number:
PCT/JP2017/005821
Publication Date:
August 24, 2017
Filing Date:
February 17, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B5/14; B32B3/24; H01B13/00; H05K3/40
Foreign References:
| JPS60200425A | 1985-10-09 | |||
| JPH05343823A | 1993-12-24 | |||
| JP2010076100A | 2010-04-08 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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