LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

Title:

LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2006/067929

Kind Code:

A1

Abstract:

On ceramic green sheets (2), coil conductor patterns (3-7) and extracting electrodes (8-9) are formed by a screen printing method, respectively, in a status where the sheets are not lined with carrier films, and at the same time, a hole for via hole is filled with a conductive paste and a via hole (15) is formed. The coil conductor patterns (3-7) are provided with first lands (3a-6a) on one end to cover the via hole (15) for interlayer connection, and second lands (4b-7b) on the other end to receive the via hole (15). It is suitable that the diameter of the second lands (4b-7b) is larger than that of the first lands (3a-6a), and the area of the second lands (4b-7b) is 1.10-2.25 times the area of the first lands (3a-6a).

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Inventors:

UEDA MITSURU (JP)
IKEDA MASAHARU (JP)

Application Number:

PCT/JP2005/021544

Publication Date:

June 29, 2006

Filing Date:

November 24, 2005

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
UEDA MITSURU (JP)
IKEDA MASAHARU (JP)

International Classes:

H01F17/00; H01F41/04

Foreign References:

JPS60217621A	1985-10-31
JPS6444605U	1989-03-16
JP2003282327A	2003-10-03
JP2000082615A	2000-03-21
JP2005191191A	2005-07-14

Attorney, Agent or Firm:

Morishita, Takekazu (2-18 Minamihommachi 4-chome Chuo-k, Osaka-shi Osaka 54, JP)

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