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Title:
LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2011/114809
Kind Code:
A1
Abstract:
Provided is a laminated ceramic electronic component which has excellent mechanical properties and excellent corrosion resistance of internal electrodes, has considerable design freedom with respect to the ceramic material, is low cost, has a low defect rate, and has numerous other characteristics. The laminated ceramic electronic component includes: a laminated body which is provided with a plurality of laminated ceramic layers, and is also provided with a plurality of internal electrodes that are composed mainly of an Al/Si alloy and are formed along specified interfacial surfaces between the ceramic layers; and external electrodes which are formed on the outer surface of the laminated body, wherein the Al/Si ratio of the Al/Si alloy is at least 85/15.

Inventors:
BANNO, Koichi (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
伴野 晃一 (〒55 京都府長岡京市東神足1丁目10番1号 株式会社 村田製作所内 Kyoto, 〒6178555, JP)
SUZUKI, Shoichiro (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
鈴木 祥一郎 (〒55 京都府長岡京市東神足1丁目10番1号 株式会社 村田製作所内 Kyoto, 〒6178555, JP)
NAKAMURA, Masanori (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
中村 将典 (〒55 京都府長岡京市東神足1丁目10番1号 株式会社 村田製作所内 Kyoto, 〒6178555, JP)
Application Number:
JP2011/052528
Publication Date:
September 22, 2011
Filing Date:
February 07, 2011
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足1丁目10番1号 Kyoto, 〒6178555, JP)
BANNO, Koichi (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
伴野 晃一 (〒55 京都府長岡京市東神足1丁目10番1号 株式会社 村田製作所内 Kyoto, 〒6178555, JP)
SUZUKI, Shoichiro (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
鈴木 祥一郎 (〒55 京都府長岡京市東神足1丁目10番1号 株式会社 村田製作所内 Kyoto, 〒6178555, JP)
NAKAMURA, Masanori (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01G4/30; H01B1/02; H01F17/00; H01F17/04; H01G4/12
Foreign References:
JP2005039179A2005-02-10
JP2008038207A2008-02-21
JPH09213131A1997-08-15
JP2009170875A2009-07-30
JP2000182880A2000-06-30
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Claims: