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Patent Searching and Data


Title:
LAMINATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/1994/022281
Kind Code:
A1
Abstract:
This invention provides a laminated circuit board capable of setting constants of various circuit devices mounted on the laminated circuit board by selective connection between wiring layers, and a laminated circuit board capable of arbitrarily setting distributed circuit constants in a high frequency wiring layer interposed between two shield wiring layers. The laminated circuit board includes a plurality of wiring layers (11-1m) each having a conductive pattern formed on an insulator layer, a connection wiring layer (2) laminated on the surface of a plurality of laminated wiring layers, a plurality of terminal patterns (21 to 2n, 20) formed in a mutually insulated state on the connection wiring layer, a plurality of vias (P1 to Pn) for electrically connecting at least two of the terminal patterns to the corresponding patterns of the wiring layers, and connection means for connecting mutually and selectively the terminal patterns.

Inventors:
MISHIRO HIDEHIRO (JP)
TSUBONE KENICHIRO (JP)
ABE MITSUNORI (JP)
TAKADA RIE (JP)
Application Number:
PCT/JP1994/000327
Publication Date:
September 29, 1994
Filing Date:
February 28, 1994
Export Citation:
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Assignee:
FUJITSU LTD (JP)
MISHIRO HIDEHIRO (JP)
TSUBONE KENICHIRO (JP)
ABE MITSUNORI (JP)
TAKADA RIE (JP)
International Classes:
H01F17/00; H03H1/00; H05K1/00; H05K1/16; H05K1/03; H05K1/11; H05K3/46; (IPC1-7): H05K3/46; H01C7/00; H01C13/02; H01F15/00; H01F17/00; H01G4/34; H01G4/40; H01P3/08; H01P5/02; H03H7/075
Foreign References:
JPH02215194A1990-08-28
JPH027483Y21990-02-22
JPS59132611A1984-07-30
JPS59181501A1984-10-16
JPS59132643A1984-07-30
JP4035886B
JPH02246299A1990-10-02
JPH0493114U1992-08-13
JPH01313908A1989-12-19
JPS5983010U1984-06-05
JPH04291803A1992-10-15
JPH0458601A1992-02-25
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