Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LAMINATED CORE GROUNDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/132666
Kind Code:
A1
Abstract:
To obtain a laminated core grounding structure capable of establishing a ground at reduced cost, a laminated core grounding structure is provided with: a laminated core (1) which is configured by laminating steel sheets (10) each having a plate shape; insulating coverings (11) which respectively cover both surfaces of the steel sheets (10) approximately perpendicular to the lamination direction; a mounting base (5) which conducts to an external ground (7) and to which the laminated core (1) is mounted; a mounting bolt (3) which is screwed into the mounting base (5) to fasten the laminated core (1) to the mounting base (5); and a conduction part (2) which is provided between the head (3a) of the mounting bolt (3) and the steel sheet (10) and brings the mounting bolt (3) and the steel sheet (10) into conduction by breaking the insulating covering (11) by the fastening force of the mounting bolt (3).

Inventors:
NISHIYORI KOICHIRO (JP)
BABA TAKENORI (JP)
MOCHIZUKI DAI (JP)
Application Number:
PCT/JP2012/056201
Publication Date:
September 12, 2013
Filing Date:
March 09, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
NISHIYORI KOICHIRO (JP)
BABA TAKENORI (JP)
MOCHIZUKI DAI (JP)
International Classes:
H02K1/18; F16B5/02; F16B35/00; F16B43/00; H01F27/245; H01F27/26; H02K5/00; H05K7/00
Foreign References:
JP2009177917A2009-08-06
JP2003106319A2003-04-09
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Download PDF:
Claims: