Title:
LAMINATED DECORATION BOARD
Document Type and Number:
WIPO Patent Application WO/2002/094519
Kind Code:
A1
Abstract:
A thick and lightweight decoration board formed by laminating plate materials. Plate materials (1, 2) composing a head board (A) as a decoration board are pasted together. A plurality of depressions (5) are formed proximately to each other while leaving the circumferential fringe part on the inner surface of the plate material (1). Since thin plate parts (6) are formed partially by the depressions (5), a thick, massive and lightweight head board (A) can be obtained.
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Inventors:
Annaka, Shigeru c/o Annaka Factory Co. (Ltd. 1182 Ohaza-Ishizone Muramatsu-mach, Nakakanbara-gun Niigata, 959-1795, JP)
Application Number:
PCT/JP2002/001348
Publication Date:
November 28, 2002
Filing Date:
February 18, 2002
Export Citation:
Assignee:
Annaka Factory, Ltd CO. (1182, Ohaza-Ishizone Muramatsu-machi Nakakanbara-gun, Niigata, 959-1795, JP)
International Classes:
B27M3/18; A47C19/02; B27D1/08; B27H1/00; B27M3/00; B32B3/30; B44C3/08; B44C5/04; E06B3/70; E06B3/84; (IPC1-7): B27D5/00; B27H1/00
Attorney, Agent or Firm:
Ushiki, Mamoru (4th Floor, Fujii Daiichi Bldg. 11-11 Uchikanda 1-chome Chiyoda-ku, Tokyo, 101-0047, JP)
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