Title:
LAMINATED DEVICE, LAMINATED BODY, AND METHOD FOR MANUFACTURING LAMINATED DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/173764
Kind Code:
A1
Abstract:
Provided are: a laminated device, which ensures bonding strength, and has excellent heat dissipating characteristics; a laminated body; and a method for manufacturing the laminated device. The laminated device includes a laminated body having a plurality of semiconductor bodies that are electrically connected to each other, each of the semiconductor bodies has a surface, on which a plurality of terminals are provided, and the terminals include terminals which bond and electrically connect the semiconductor bodies to each other, and terminals which bond but do not electrically connect the semiconductor bodies to each other. With respect to the semiconductor surface on which the terminals are provided, the area ratio of the terminals is 40 % or more, and the area ratio of the terminals that bond and electrically connect the semiconductor bodies to each other among the terminals is less than 50 %.
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Inventors:
HOTTA YOSHINORI (JP)
Application Number:
PCT/JP2018/008902
Publication Date:
September 27, 2018
Filing Date:
March 08, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L25/065; H01L21/60; H01L25/07; H01L25/18
Foreign References:
| JP2015135875A | 2015-07-27 | |||
| JP2013243263A | 2013-12-05 | |||
| JP2015106617A | 2015-06-08 | |||
| JP2003109691A | 2003-04-11 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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