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Patent Searching and Data


Title:
LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/108151
Kind Code:
A1
Abstract:
[Problem] To provide a laminated electronic component that can reduce the emission of sound when mounted on a substrate. [Solution] The present invention is provided with: a main body (1) having an effective layer (5), in which dielectric layers (3) and internal electrode layers (4) are laminated in alternation, and a first cover layer (6) and second cover layer (7) that are a pair of cover layers provided to the two sides in the direction of lamination of the effective layer (5); and a plurality of external electrodes (2) provided to the outer surface of the main body (1). Each of the internal electrode layers (4) is connected to a different external electrode (2) and the first cover layer (6) has a high-Young's-modulus layer (10) having a higher Young's modulus than the dielectric layers (4). The laminated electronic component can reduce the emission of sound by means of being mounted to a substrate (21) in a manner such that the first cover layer (6) opposes the mounting surface of the substrate (21).

Inventors:
NISHIMURA MICHIAKI (JP)
SHIGENAGA YASUHISA (JP)
Application Number:
PCT/JP2015/051097
Publication Date:
July 23, 2015
Filing Date:
January 16, 2015
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01G4/12; H01G2/06; H01G4/232; H01G4/30
Foreign References:
JP2012094785A2012-05-17
JP2007103496A2007-04-19
JP2008300566A2008-12-11
JPS62135426U1987-08-26
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