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Title:
LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/017634
Kind Code:
A1
Abstract:
[Problem] To provide a laminated electronic component that can reduce sounding when mounted on a substrate, and a mounting structure thereof. [Solution] A laminated electronic component 1 is provided with a pair of first conductors 3 and a pair of second conductors 4 on the outer surface of a rectangular parallelepiped-shaped laminated body 2 in which dielectric layers 5 and internal electrode layers 6 are alternately laminated, and the first conductors 3 are each provided at a site that includes the center of a long side 8 of a first principal surface 7A located in the direction of lamination of the dielectric layers 5 and the internal electrode layers 6 of the laminated body 2 and that does not include any vertex V of the laminated body 2 and on a first side surface 10 to the first principal surface 7A. The second conductors 4 are provided on second side surfaces 11, and the first conductors 3 and the second conductors 4 are spaced apart from each other on the outer surface and electrically connected to each other via the internal electrode layers 6. The laminated electronic component 1 can reduce the sounding by means of being mounted on a substrate 12 such that projection sections 3b of the first conductors are opposed to the substrate 12.

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Inventors:
NISHIMURA,Michiaki (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
SHIGENAGA,Yasuhisa (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2015/071365
Publication Date:
February 04, 2016
Filing Date:
July 28, 2015
Export Citation:
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Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
H01G4/232; H01G4/252; H01G4/30
Foreign References:
JP2006286930A2006-10-19
JP2012069766A2012-04-05
JP2007194312A2007-08-02
JP2012023322A2012-02-02
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