Title:
LAMINATED ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING SAME
Document Type and Number:
WIPO Patent Application WO/2015/098990
Kind Code:
A1
Abstract:
[Problem] To provide a laminated electronic component that allows audible ringing to be reduced when mounted on a substrate, and a structure for mounting the laminated electronic component. [Solution] A laminated electronic component having a body (1) configured from a laminate (2) having alternatively laminated dielectric layers (6) and internal electrode layers (7), and an external electrode (3) provided on the outer surface of the laminate (2) and electrically connected to the internal electrode layers (7), the body (1) being further provided with a first joining member (4) and a second joining member (5), provided on a first surface (8) side located in the lamination direction of the dielectric layers (6) and the internal electrode layers (7), the first joining member (4) and the second joining member (5) being respectively provided to a first side (11) and a second side (12) that constitute the first surface (8), and being located in a region that includes the respective centers (11c, 12c) but not the vertex (V) of the body (1). The first surface (8) has a third side (13) not provided with a joining member. Mounting such a laminated electronic component on a substrate (21) with the bonding members (4, 5) interposed therebetween makes it possible to reduce audible ringing.
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Inventors:
NISHIMURA MICHIAKI (JP)
SHIGENAGA YASUHISA (JP)
SHIGENAGA YASUHISA (JP)
Application Number:
PCT/JP2014/084199
Publication Date:
July 02, 2015
Filing Date:
December 24, 2014
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01G4/228; H01G2/06; H01G4/12; H01G4/30
Domestic Patent References:
| WO2007105395A1 | 2007-09-20 |
Foreign References:
| JP2007103496A | 2007-04-19 | |||
| JPS62135426U | 1987-08-26 | |||
| JP2007194313A | 2007-08-02 | |||
| JPH11162780A | 1999-06-18 |
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