Title:
LAMINATED ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/032464
Kind Code:
A1
Abstract:
Disclosed is a laminated electronic component that is equipped with a first coil pattern (3) which is formed on multiple insulating layers (1), (5), and both ends of which are connected to external electrodes, and a second coil pattern (6) which is arranged to be opposite the first coil pattern (3) with at least one insulating layer (5) intervening, and that is configured so that the two ends (6a), (6b) of the second coil pattern (6) are not connected to external electrodes.
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Inventors:
UENO, Kenji (())
Application Number:
JP2009/004669
Publication Date:
March 25, 2010
Filing Date:
September 17, 2009
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
International Classes:
H01F30/00; H01F17/00; H01F27/00; H03H7/09
Attorney, Agent or Firm:
NAITO, Hiroki et al. (1006 Oaza Kadoma, Kadoma-sh, Osaka 01, 〒5718501, JP)
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