LAMINATED FILM BODY CUTTING DEVICE AND LAMINATED FILM BODY CUTTING METHOD

WIPO Patent Application WO/2011/152310

A1

Disclosed is a cutting device provided with a cutting tool unit (7) which cuts some of the films of a laminated film body. This cutting device moves the cutting tool unit (7) along a cutting cradle (20) which supports a laminated film body, thereby cutting some of the films of the laminated film body wherein a plurality of films are laminated. The cutting device is also provided with a linear unit which adjusts the position of the cutting tool unit (7) with respect to the cutting cradle (20), a dial gauge (12) which measures distances, and a control section which controls the linear unit. The control unit controls the linear unit so that the cutting direction of the cutting tool unit (7) with respect to the laminated film body will be parallel to the cutting cradle (20) on the basis of information regarding distances between a dial gauge (12) and the cutting cradle (20) at locations along the length direction of the cradle (20), said distances being measured by the dial gauge (12) or a displacement sensor.

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KISHIZAKI, Kazunori (())
岸▲崎▼　和範 (())

JP2011/062228

December 08, 2011

May 27, 2011

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SUMITOMO CHEMICAL COMPANY, LIMITED (27-1, Shinkawa 2-chome Chuo-k, Tokyo 60, 〒1048260, JP)
住友化学株式会社 (〒60 東京都中央区新川二丁目２７番１号 Tokyo, 〒1048260, JP)
KISHIZAKI, Kazunori (())

B26D3/08

HASEGAWA, Kazuya et al. (HARAKENZO WORLD PATENT & TRADEMARK, Daiwa Minamimorimachi Building 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-sh, Osaka 41, 〒5300041, JP)

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