Title:
LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/185606
Kind Code:
A1
Abstract:
Provided is a laminated film that includes a heat-resistant polymer film and a first protective film laminated on one of the surfaces of the heat-resistant polymer film, wherein: the first protective film has a first substrate and a first adhesive layer provided on the first substrate; the first substrate, the first adhesive layer, and the heat-resistant polymer film are laminated in this order; the first substrate is a polyester film or a polyolefin film; the first adhesive layer contains a urethane-based resin; and the maximum diameter of a gelled product in the first adhesive layer is equal to or less than 14 µm.
Inventors:
TOKUDA KAYA (JP)
OKUYAMA TETSUO (JP)
MAEDA SATOSHI (JP)
WATANABE NAOKI (JP)
AKASHI MAYUMI (JP)
OKUYAMA TETSUO (JP)
MAEDA SATOSHI (JP)
WATANABE NAOKI (JP)
AKASHI MAYUMI (JP)
Application Number:
PCT/JP2021/039796
Publication Date:
September 09, 2022
Filing Date:
October 28, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/32; B32B27/36; B32B27/40; C09K3/00
Domestic Patent References:
| WO2016031746A1 | 2016-03-03 | |||
| WO2016031746A1 | 2016-03-03 | |||
| WO2018207938A1 | 2018-11-15 |
Foreign References:
| JP2020100026A | 2020-07-02 | |||
| JP2008207356A | 2008-09-11 | |||
| JP2001102636A | 2001-04-13 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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