Title:
LAMINATED FILM AND METHOD OF FORMING FILM
Document Type and Number:
WIPO Patent Application WO/2002/072909
Kind Code:
A1
Abstract:
A method of forming a film having a uniform film thickness and a crystal axis positioned parallel with the major surface of a substrate by spraying a film forming material from the surface of a target (12) so as to stack the sprayed film forming material on the major surface (100a) of the substrate (100), comprising the steps of positioning the substrate (100) in a first state that the distance between one end (100f) of the substrate (100) and the target (12) is small and the distance between the other end (100e) and the target (12) is relatively large, forming a first film (110) on the substrate (100) in the first state, positioning the substrate (100) in a second state that the distance between one end (100f) of the substrate (100) and the target (12) is large and the distance between the other end (100e) and the target (12) is small, and forming a second film (120) on the first film (110) in the second state.
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Inventors:
TANEDA TAKAHIRO (JP)
FUJINO KOSO (JP)
OHMATSU KAZUYA (JP)
FUJINO KOSO (JP)
OHMATSU KAZUYA (JP)
Application Number:
PCT/JP2001/010814
Publication Date:
September 19, 2002
Filing Date:
December 10, 2001
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
INT SUPERCONDUCTIVITY TECH (JP)
TANEDA TAKAHIRO (JP)
FUJINO KOSO (JP)
OHMATSU KAZUYA (JP)
INT SUPERCONDUCTIVITY TECH (JP)
TANEDA TAKAHIRO (JP)
FUJINO KOSO (JP)
OHMATSU KAZUYA (JP)
International Classes:
C23C14/08; C23C14/22; C23C14/28; C23C14/34; C30B23/02; B32B9/00; C30B29/22; H01B13/00; H01L39/24; (IPC1-7): C23C14/08; C23C14/24; C01G1/00; C01G3/00
Foreign References:
| EP0669411A2 | 1995-08-30 | |||
| EP0872579A1 | 1998-10-21 | |||
| US4874664A | 1989-10-17 | |||
| US6187445B1 | 2001-02-13 |
Other References:
See also references of EP 1375697A4
Attorney, Agent or Firm:
Fukami, Hisao (Minamimorimachi 2-chome Kita-ku Osaka-shi, Osaka, JP)
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