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Patent Searching and Data


Title:
LAMINATED FILM AND MULTILAYER BODY, AND PACKAGE AND PACKAGED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/189005
Kind Code:
A1
Abstract:
A laminated film according to one aspect of the present invention comprises at least a base layer and a sealant layer, wherein the sealant layer is composed of a resin composition having a thermoplastic elastomer (B) as a main component, and the resin composition has an acid value of 0.5 mgCH3ONa/g to 4.3 mgCH3ONa/g. The laminated film having excellent heat lamination suitability, wet heat resistance, and temporal stability can be provided.

Inventors:
YAMADA HIROTO (JP)
Application Number:
PCT/JP2023/006041
Publication Date:
October 05, 2023
Filing Date:
February 20, 2023
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/00; B65D65/40
Foreign References:
JP2021054881A2021-04-08
JP2018150542A2018-09-27
JP2017159662A2017-09-14
JP2019199612A2019-11-21
JP2011252101A2011-12-15
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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