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Patent Searching and Data


Title:
LAMINATED FILM AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/100662
Kind Code:
A1
Abstract:
A laminated film comprising a first substrate, a second substrate, and an adhesive layer disposed between the first and second substrates, wherein the first and second substrates are each made of a thermoplastic resin comprising an olefin-based resin as a main component and the adhesive layer is made of an adhesive comprising a metal soap or metal chelate compound and an olefin-based resin (A) modified with an acid and/or a hydroxyl group; and a packaging material comprising the laminated film. The laminated film can give recycled plastics without impairing the quality, can be easily produced, and can retain functions including interlaminar adhesion strength.

Inventors:
MATSUO TAKATOSHI (JP)
NAGATA YOSHITOMO (JP)
TOKUNAGA SENYUU (JP)
NAKANO HIROAKI (JP)
Application Number:
PCT/JP2022/042644
Publication Date:
June 08, 2023
Filing Date:
November 17, 2022
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/32; B65D65/40; C09J11/06; C09J123/00
Foreign References:
JPH08197692A1996-08-06
JP2003176467A2003-06-24
JP2006233125A2006-09-07
JP2015059200A2015-03-30
JPS53123441A1978-10-27
Attorney, Agent or Firm:
ONO Takayuki (JP)
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