Title:
LAMINATED FILM FOR SKIN PACK PACKAGING, PACKAGING BODY, AND MANUFACTURING METHOD FOR PACKAGING BODY
Document Type and Number:
WIPO Patent Application WO/2017/187766
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a laminated film for skin pack packaging that allows easy manufacturing of a packaging body wherein an object to be packaged is packaged in a skin pack on tray-shaped bottom material and a top film (cover film) is provided. This laminated film 4 for skin pack packaging is characterized in that a resin first film 1 that has a through-hole section 3 and a resin second film 2 that either has a lower draw ratio than the first film 1 or is not stretched are adhered in a state in which same can be separated.
Inventors:
INAGAKI HIROMICHI (JP)
TAKAHASHI SAKARU (JP)
TAKAHASHI SAKARU (JP)
Application Number:
PCT/JP2017/007741
Publication Date:
November 02, 2017
Filing Date:
February 28, 2017
Export Citation:
Assignee:
CHOKOKU PLAST CORP (JP)
INAGAKI HIROMICHI (JP)
INAGAKI HIROMICHI (JP)
International Classes:
B65D65/40; B32B3/24; B32B7/06; B65D75/30
Foreign References:
| US20120005988A1 | 2012-01-12 | |||
| JPH106428A | 1998-01-13 | |||
| JPH0435665A | 1992-02-06 | |||
| JP2005225925A | 2005-08-25 | |||
| US5103618A | 1992-04-14 | |||
| JPS4886083U | 1973-10-18 |
Attorney, Agent or Firm:
SAKAI, Masami (JP)
Download PDF:
Previous Patent: SOLID-STATE LIGHT SOURCE DEVICE AND ELECTRONIC APPARATUS USING SAME
Next Patent: POWER AMPLIFICATION APPARATUS
Next Patent: POWER AMPLIFICATION APPARATUS