Title:
LAMINATED FLAT CABLE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/002764
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a laminated flat cable and a manufacturing method therefor whereby variability in the characteristic impedance of a signal line can be minimized. A dielectric body (12) comprises a dielectric sheet (18a) that has a top surface and a bottom surface and another dielectric sheet (18b) that has a top surface and a bottom surface, laminated together. A signal line (20) that transmits high-frequency signals is formed on the bottom surface of one dielectric sheet (18a). A reference ground conductor (22) is formed on the top surface of said dielectric sheet (18a) and faces the signal line (20). An auxiliary ground conductor (24) is formed on the bottom surface of the other dielectric sheet (18b) and also faces the signal line (20). A plurality of openings (30) lined up along the signal line (20) are provided in the auxiliary ground conductor (24).
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Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2013/066209
Publication Date:
January 03, 2014
Filing Date:
June 12, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P11/00; H01P3/08; H05K1/02
Domestic Patent References:
| WO2012074100A1 | 2012-06-07 |
Foreign References:
| JP2007123740A | 2007-05-17 | |||
| JPH039502U | 1991-01-29 | |||
| JPH08242117A | 1996-09-17 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
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