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Patent Searching and Data


Title:
LAMINATED LC FILTER
Document Type and Number:
WIPO Patent Application WO/2021/039246
Kind Code:
A1
Abstract:
Provided is a laminated LC filter which improves return loss and suppresses a narrowing of the passband. A multilayered substrate 1 is configured in a manner such that: a via electrode 2q, which is the end section of a first inductor L1 on the ground terminal G1, G2 side thereof, is connected to a shield electrode 5; the end section (connection point between capacitor electrode 4e and via electrode 2k) on the signal line 6 side is positioned on the first principal surface 1A side of the end section (connection point between via electrode 2q and shield electrode 5) on the ground terminal G1, G2 side in the direction in which the substrate layers 1a-1q are layered; the via electrode 2r, which is the end section of a second inductor L2 on the ground terminal G1, G2 side, is connected to the shield electrode 5; and the end section (connection point between capacitor electrode 4f and via electrode 2l) on the signal line 6 side is positioned on the first principal surface 1A side of the end section (connection point between via electrode 2r and shield electrode 5) on the ground terminal G1, G2 side in the direction in which the substrate layers 1a-1g are layered.

Inventors:
MASUDA HIROSHI (JP)
WATANABE KUNIHIRO (JP)
YUASA RUMIKO (JP)
Application Number:
PCT/JP2020/028869
Publication Date:
March 04, 2021
Filing Date:
July 28, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/00; H01F27/29; H01F27/36; H01G4/40; H03H7/075
Domestic Patent References:
WO2015059964A12015-04-30
Foreign References:
JP2000357932A2000-12-26
JPH09307389A1997-11-28
Attorney, Agent or Firm:
KAWAMOTO, Takashi (JP)
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