Title:
LAMINATED PLATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/176423
Kind Code:
A1
Abstract:
Provided is a laminated plate (100) manufacturing method, wherein a laminating step of obtaining a laminated body by laminating a build-up prepreg (200) which is formed by a resin composition including a heat-curing resin with heat and pressure applied thereto in a circuit forming face (103) of a core layer (102), said circuit forming face (103) being on one face or both faces of said core layer (102), and a smoothing step of smoothing the surface of the laminated build-up prepreg (200), are sequentially carried out, followed thereafter by a curing step of heating the laminated body, further advancing the curing of the heat-curing resin. In dynamic viscoelasticity tests of the build-up prepreg (200) at the stage where the laminating step is completed, under conditions of a temperature range of 50-200 °C, a rate of temperature increase of 3 °C/min., and a frequency of 62.83 rad/sec., with the minimum value of complex dynamic viscosity designated η1, η1 is 20Pa∙s-300Pa∙s.
Inventors:
ENDO TADASUKE (JP)
KIMURA MICHIO (JP)
KIMURA MICHIO (JP)
Application Number:
PCT/JP2012/003963
Publication Date:
December 27, 2012
Filing Date:
June 18, 2012
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
ENDO TADASUKE (JP)
KIMURA MICHIO (JP)
ENDO TADASUKE (JP)
KIMURA MICHIO (JP)
International Classes:
H05K3/46; B32B15/08; C08J5/24
Domestic Patent References:
| WO2009119621A1 | 2009-10-01 | |||
| WO2003099952A1 | 2003-12-04 |
Foreign References:
| JP2008198774A | 2008-08-28 | |||
| JP2005251895A | 2005-09-15 | |||
| JP2006179888A | 2006-07-06 | |||
| JP2005240019A | 2005-09-08 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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Claims:
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