LAMINATED SHEET AND ELECTRONIC COMPONENT PACKAGING CONTAINER MOLDED USING SAME

Title:

LAMINATED SHEET AND ELECTRONIC COMPONENT PACKAGING CONTAINER MOLDED USING SAME

Document Type and Number:

WIPO Patent Application WO/2019/146630

Kind Code:

A1

Abstract:

[Problem] To provide a laminated sheet having good moldability and excellent sealing property with a lid material, particularly a pressure-sensitive adhesive cover tape, and an electronic component packaging container molded using the same. [Solution] A laminated sheet having a surface layer on both sides of a substrate layer, wherein the surface layer includes the following component (A), and the substrate layer includes, relative to the total mass of the substrate layer, 30-70 mass% of the following component (B), 70-30 mass% of the following component (C), and 0-30 mass% of a recycled material of the laminated sheet. Component (A): a rubber-modified (meth)acrylic acid ester-vinyl aromatic hydrocarbon copolymer including 5-15 mass% of a conjugated diene rubber component. Component (B): a vinyl aromatic hydrocarbon-conjugated diene block copolymer including 15-30 mass% of a monomer unit derived from a conjugated diene. Component (C): at least one polymer selected from the group consisting of vinyl aromatic hydrocarbon polymers and rubber-modified vinyl aromatic hydrocarbon polymers.

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Inventors:

YANAKA RYOSUKE (JP)
MASUDA YUSUKE (JP)

Application Number:

PCT/JP2019/002050

Publication Date:

August 01, 2019

Filing Date:

January 23, 2019

Export Citation:

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Assignee:

DENKA COMPANY LTD (JP)

International Classes:

B32B27/30; B65D65/40; B65D75/34; B65D85/38

Domestic Patent References:

WO2012102287A1

2012-08-02

Foreign References:

JPH08244179A	1996-09-24
JP2002113818A	2002-04-16
JP2011042072A	2011-03-03
JP2004042360A	2004-02-12
JP2005238614A	2005-09-08
JP2006281452A	2006-10-19
JP2010214607A	2010-09-30

Attorney, Agent or Firm:

SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)

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