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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2018/150859
Kind Code:
Provided is a laminated sheet allowing for firm bonding or anchoring to a rough-surfaced adherend. In accordance with the present invention, there is provided a laminated sheet comprising a porous substrate and a resin layer provided on at least one side thereof. The porous substrate has a 25% compression hardness of 1.00 MPa or less. The resin layer contains an acrylic polymer constituted by a polymer of monomer components including a monomer a1 and a monomer a2. Monomer a1 is a C4–14 alkyl (meth)acrylate, and monomer a2 is at least one selected from the group consisting of a concatenated ether-bond-comprising (meth)acrylate and a branched C15–20 alkyl (meth)acrylate. Monomer a1 constitutes 50–97% by weight of the monomer components, and monomer a2 constitutes 3–50% by weight thereof. The laminated sheet has a tensile break strength Ta of at least 0.9 × 106 Pa.

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HIGASHI, Masatsugu (1-1-2 Shimohozumi, Ibaraki-sh, Osaka 80, 〒5678680, JP)
Application Number:
Publication Date:
August 23, 2018
Filing Date:
January 30, 2018
Export Citation:
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NITTO DENKO CORPORATION (1-1-2, Shimohozumi Ibaraki-sh, Osaka 80, 〒5678680, JP)
International Classes:
B32B27/30; B32B5/18; C09J11/06; C09J133/02; C09J133/06; C09J133/14; C09J175/04; C08F220/12
Attorney, Agent or Firm:
OI, Michiko (Kyodo Patent Law Firm, BPR Place Hisaya-Odori 3-20-3, Marunouchi, Naka-ku, Nagoya-sh, Aichi 02, 〒4600002, JP)
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