Title:
LAMINATED STRETCHED POLYAMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2019/142631
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a laminated stretched polyamide film which has excellent impact resistance, bending pinhole resistance and friction pinhole resistance, and which has less deteriorated matter attached to a die slip outlet during production and has less thickness unevenness. A laminated biaxially stretched polyamide film according to the present invention is characterized by laminating a surface layer (B layer) on both sides of a base layer (layer A), wherein the surface layer comprises a polyamide resin composition containing 100-80 mass% of a polyamide 6 resin, less than 1 mass% of a polyamide-based elastomer, and 0-20 mass% of a polyamide resin other than the polyamide 6 and the polyamide-based elastomer, and the base layer comprises a polyamide resin composition containing a mixed resin composed of 97.5-80 mass% of the polyamide 6 resin and 2.5-20 mass% of the polyamide-based elastomer, the number of bending pinholes being 5 or less, and a friction pinhole occurrence distance being 3000 cm or more.
Inventors:
UEDA KAZUSHIGE (JP)
ENDO TAKURO (JP)
HAMA KOSUKE (JP)
ENDO TAKURO (JP)
HAMA KOSUKE (JP)
Application Number:
PCT/JP2018/047787
Publication Date:
July 25, 2019
Filing Date:
December 26, 2018
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/34; B65D65/40
Foreign References:
| JP2000052516A | 2000-02-22 | |||
| JP2000238216A | 2000-09-05 | |||
| JP2002166512A | 2002-06-11 |
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