Title:
LAMINATED STRUCTURE, ELEMENT, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/048768
Kind Code:
A1
Abstract:
[Problem] To provide: a laminated structure with excellent bending strength; an element; an electronic device; an electronic apparatus; and a system. [Solution] This laminated structure is constituted of at least a first layer and a second layer that are layered onto a crystalline substrate. The first layer is made of a metallic compound film, and the second layer is made of a metal film of a metal that undergoes martensitic transformation by heat treatment or machining. The crystalline substrate, the first layer, and the second layer are aligned in roughly the same crystal axis direction. The laminated structure is used to manufacture a piezoelectric element or a semiconductor element.
Inventors:
KIJIMA TAKESHI (JP)
Application Number:
PCT/JP2023/032027
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
GAIANIXX INC (JP)
International Classes:
H10N30/853; B32B9/00; C23C14/06; C23C14/08; C23C14/14; C23C14/34; H02N2/00; H10N30/079; H10N30/20; H10N30/30; H10N30/50; H10N30/87
Domestic Patent References:
| WO2022168800A1 | 2022-08-11 |
Foreign References:
| JP2014169466A | 2014-09-18 | |||
| JP2012029109A | 2012-02-09 |
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