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Patent Searching and Data


Title:
LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/203852
Kind Code:
A1
Abstract:
This laminated structure is formed by sequentially laminating a first laminate, a second laminate, and a third laminate. The first laminate, the second laminate, and the third laminate have melting points different from each other, and the melting point of the second laminate is higher than the melting point of either the first laminate or the third laminate.

Inventors:
KITAGAWA HIROKI
YOSHIDA TAKAYUKI
Application Number:
PCT/JP2023/005374
Publication Date:
October 26, 2023
Filing Date:
February 16, 2023
Export Citation:
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Assignee:
PANASONIC HOLDINGS CORP (JP)
International Classes:
B32B7/025; H01L23/36; B32B9/00; B32B38/18; H01L23/12; H01L23/13; H05K3/04; H05K3/38; H05K3/46
Domestic Patent References:
WO2011065457A12011-06-03
Foreign References:
JP2014175492A2014-09-22
JP2014179416A2014-09-25
JP2012056308A2012-03-22
JP2007227867A2007-09-06
JP2002076214A2002-03-15
Attorney, Agent or Firm:
TOKUDA Yoshiaki et al. (JP)
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