Title:
LAMINATED SUBSTRATE AND ANTENNA SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/239572
Kind Code:
A1
Abstract:
A laminated substrate 1 comprises, in the stated order in the lamination direction: a first thermoplastic resin layer 10; a second thermoplastic resin layer 20 that has a first main surface 20a and a second main surface 20b and that is adjacent to the first thermoplastic resin layer 20 on the first main surface 20a side; and a conductive layer 30 that is adjacent to the second thermoplastic resin layer 20 on the second main surface 20b side of the second thermoplastic resin layer 20. The dielectric constant of the second thermoplastic resin layer 20 is greater than the dielectric constant of the first thermoplastic resin layer 10. The coefficient of linear thermal expansion of the second thermoplastic resin layer 20 in the in-plane direction is greater than the coefficient of linear thermal expansion of the conductive layer 30 in the in-plane direction. The coefficient of linear thermal expansion of the first thermoplastic resin layer 10 in the in-plane direction is greater than 0 ppm/K and smaller than the coefficient of linear thermal expansion of the conductive layer 30 in the in-plane direction.
Inventors:
SHIMAMURA TAKAYUKI (JP)
FURUMURA TOMOHIRO (JP)
FUKUTAKE SUNAO (JP)
FURUMURA TOMOHIRO (JP)
FUKUTAKE SUNAO (JP)
Application Number:
PCT/JP2022/016568
Publication Date:
November 17, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B32B7/025; B32B15/08; B32B15/082; H01Q13/08; H05K1/03; H05K3/46
Domestic Patent References:
| WO2020071473A1 | 2020-04-09 |
Foreign References:
| JP2016062954A | 2016-04-25 | |||
| JP2015074157A | 2015-04-20 | |||
| JP2016006832A | 2016-01-14 | |||
| JP2020038289A | 2020-03-12 | |||
| JP2020132849A | 2020-08-31 | |||
| JP2019093548A | 2019-06-20 | |||
| JP2016068277A | 2016-05-09 | |||
| JPH11289201A | 1999-10-19 | |||
| JPH0432289A | 1992-02-04 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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