Title:
LAMINATED SUBSTRATE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/131102
Kind Code:
A1
Abstract:
This laminated substrate 1 comprises: an insulation layer 10 having a first principal surface 10a and a second principal surface 10b on opposite sides in the thickness direction; a conductor layer 20 adjacent to the first-principal-surface 10a side of the insulation layer 10; and an inter-layer connection conductor 30 provided so as to be connected to the conductor layer 20, the inter-layer connection conductor 30 penetrating the insulation layer 10 in the thickness direction but not penetrating the conductor layer 20 in the thickness direction. The insulation layer 10 contains a first material 10A formed from a resin and a second material 10B dispersed in the first material 10A, the first material 10A having the highest content ratio and the second material 10B having the next-highest content ratio after that of the first material 10A. The maximum width P of the second material 10B is less than the minimum width Q of the inter-layer connection conductor 30.
Inventors:
MATSUURA YASUSHI (JP)
SOETA YUSHI (JP)
NISHIMURA MICHIHARU (JP)
TAKADA RYOSUKE (JP)
FUKUTAKE SUNAO (JP)
SOETA YUSHI (JP)
NISHIMURA MICHIHARU (JP)
TAKADA RYOSUKE (JP)
FUKUTAKE SUNAO (JP)
Application Number:
PCT/JP2021/045172
Publication Date:
June 23, 2022
Filing Date:
December 08, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/03; H05K3/46
Domestic Patent References:
| WO2018043683A1 | 2018-03-08 |
Foreign References:
| JP2003282773A | 2003-10-03 | |||
| JP2012014843A | 2012-01-19 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: