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Title:
LAMINATED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/092688
Kind Code:
A1
Abstract:
This laminated substrate is provided with a supporting base material, an adhesion layer, and a glass substrate, in this order, wherein the adhesion layer has a concave end face. The adhesion layer has a central region contacting the glass substrate and an end region not contacting the glass substrate, and the expression "T1×2/3>T2" is satisfied, where the thickness of the central region is T1, and the thickness of the end region is T2. Also, the adhesion layer has a stepped portion between the central region and the end region, or has the concave end face.

Inventors:
YAMADA KAZUO (JP)
NAGAO YOHEI (JP)
Application Number:
PCT/JP2017/040568
Publication Date:
May 24, 2018
Filing Date:
November 10, 2017
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B32B3/02; B32B17/00; G02F1/1333
Domestic Patent References:
WO2010079688A12010-07-15
WO2011090004A12011-07-28
WO2016104450A12016-06-30
WO2012176608A12012-12-27
Foreign References:
JPS5052184A1975-05-09
JP2004170907A2004-06-17
JP2010018505A2010-01-28
JP2013226784A2013-11-07
JP2014114183A2014-06-26
JPS4838372A1973-06-06
US20120231566A12012-09-13
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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T2" is satisfied, where the thickness of the central region is T1, and the thickness of the end region is T2. Also, the adhesion layer has a stepped portion between the central region and the end region, or has the concave end face."/>