Title:
LAMINATED SUBSTRATE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2011/018983
Kind Code:
A1
Abstract:
Disclosed is a laminated substrate production method whereby LDI exposure is used to form circuit patterns on the front surface of an insulating substrate, and land sections, located on the front and rear surfaces of the insulating substrate, are connected through the layers by means of via holes. When forming land sections on one side of the insulating substrate, connecting via holes and land sections on an other side of the insulating substrate, whereby the land sections sandwich the insulating substrate, the position of the land sections on the other side is corrected and moved in the direction so as to reduce the shift amount from the land sections on the one side, according to the amount that the land sections on the one side are shifted from a preset reference position. A circuit pattern is drawn using a laser light, and the land sections on the one side and the land sections on the other side are connected through the layer by means of the via holes.
Inventors:
URATSUJI ATSUHIRO (JP)
ODAKA ISSEI (JP)
ODAKA ISSEI (JP)
Application Number:
PCT/JP2010/063330
Publication Date:
February 17, 2011
Filing Date:
August 05, 2010
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
URATSUJI ATSUHIRO (JP)
ODAKA ISSEI (JP)
URATSUJI ATSUHIRO (JP)
ODAKA ISSEI (JP)
International Classes:
G03F7/20; H05K3/00; H05K3/06; H05K3/46
Domestic Patent References:
| WO2007125791A1 | 2007-11-08 |
Foreign References:
| JPH0319395A | 1991-01-28 | |||
| JP2008078464A | 2008-04-03 | |||
| JP2004047717A | 2004-02-12 | |||
| JP2002190655A | 2002-07-05 | |||
| JPH1048835A | 1998-02-20 |
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
Koichi Hirota (JP)
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