Title:
LAMINATED-TYPE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/212273
Kind Code:
A1
Abstract:
This laminated-type electronic component (1) is provided with an element body (30) including a plurality of base material layers (a-m) laminated in a first direction (X); an inner conductor (9) provided inside the element body (30); and mounting terminals (51, 52) connected to the inner conductor (9). The laminated-type electronic component (1) has a mounting surface (5) which serves as a mounting-side surface when mounting the laminated-type electronic part (1). The mounting surface (5) is provided so as not to cross an axis (X1) along the first direction (X), and the mounting terminals (51, 52) are provided to the mounting surface (5) and embedded into the element body (30) from the mounting surface (5).
Inventors:
MATSUSHITA YOSUKE (JP)
ASAI RYOTA (JP)
ASAI RYOTA (JP)
Application Number:
PCT/JP2018/019092
Publication Date:
November 22, 2018
Filing Date:
May 17, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/29; H01F17/00; H01P5/18
Domestic Patent References:
| WO2015186538A1 | 2015-12-10 |
Foreign References:
| JP2017011044A | 2017-01-12 | |||
| JP2017022304A | 2017-01-26 | |||
| JPH0878915A | 1996-03-22 | |||
| JPH0583015A | 1993-04-02 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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