Title:
LAMINATED WIRING STRUCTURE, AND METHDOD FOR FORMING LAMINATED WIRING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/114400
Kind Code:
A1
Abstract:
In order to provide a laminated wiring structure and a method for forming the laminated wiring structure that ensure the electrical interlayer connection between upper and lower electrodes, which are laminated with an insulating layer therebetween, and that provide reliable conductivity, the present invention is equipped with a lower electrode 3, an insulating layer 4 provided above the lower electrode 3, and an upper electrode 5 provided above the insulating layer 4. A contact hole 41 is provided in the insulating layer 4. A post electrode 6 for achieving conductivity between the lower electrode 3 and the upper electrode 5 is provided in the contact hole 41. A conductive layer 7 is formed between the post electrode 6 and the upper electrode 5 by using a conductive ink.
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Inventors:
NAKAJIMA ATSUSHI (JP)
Application Number:
PCT/JP2016/051185
Publication Date:
July 21, 2016
Filing Date:
January 15, 2016
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
H05K3/46; H05K1/11; H05K3/40
Domestic Patent References:
| WO2013031815A1 | 2013-03-07 | |||
| WO2012128269A1 | 2012-09-27 |
Foreign References:
| JP2008277750A | 2008-11-13 | |||
| JP2014112722A | 2014-06-19 |
Attorney, Agent or Firm:
MARUYAMA EIICHI (JP)
Maruyama Eiichi (JP)
Maruyama Eiichi (JP)
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