Title:
LAMINATES
Document Type and Number:
WIPO Patent Application WO/2004/030884
Kind Code:
A1
Abstract:
Laminates which are improved in heat resistance and little cause defects such as blister in the reflow step can be produced by piling up a prescribed number of prepregs obtained by subjecting a substrate impregnated with a solution containing an alkoxysilane derivative and/or a condensate thereof to impregnation with a thermosetting resin free from a halogen -containing flame retardant and heat-drying the obtained resin-impregnated substrate, putting copper foil on one or both of the surfaces of the obtained pile of prepregs at need, and hot-pressing the resulting pile to form a laminate.
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| WO/2008/044397 | TRANSPARENT COMPOSITE SHEET |
Inventors:
SATOU MIKI
NARABU YOSHIYUKI
SAKAI KAZUNAGA
NARABU YOSHIYUKI
SAKAI KAZUNAGA
Application Number:
PCT/JP2003/012646
Publication Date:
April 15, 2004
Filing Date:
October 02, 2003
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08J5/24; B29B15/12; B29C70/88; B32B15/08; B32B27/04; C08K5/5435; C08L61/08; H05K1/03; (IPC1-7): B29B15/10
Foreign References:
| JPS5971332A | 1984-04-23 | |||
| JPH01146928A | 1989-06-08 | |||
| JPH06271633A | 1994-09-27 | |||
| JPH0987487A | 1997-03-31 | |||
| JPH10157011A | 1998-06-16 |
Attorney, Agent or Firm:
Hotaka, Tetsuo (Tsukiji Chuo-ku, Tokyo, JP)
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